MediaTek Helio P95 vs Qualcomm Snapdragon 765G & SD 730G vs Helio G90T vs Dimensity 1000L Compared – Antutu & Geekbench Benchmark Scores

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MediaTek recently announced their latest mid-range chipset, the Helio P95, and this has then been used for the latest Oppo Reno3 Pro 4G.

In my previous comparison of the P95 vs the older P90 and the other recently launched MediaTek chipsets the Helio G80 & Helio G70, I highlighted that it was a bit of a dud, being identical to the P90, and similar to the Helio models.

With the announcement of the Oppo Reno3 Pro 4G they have placed what appears to be a very mid-range chipset in a Pro rated phone.

In recent months there have been several superb chipsets to choose from. Towards the end of 2019 we had the MediaTek Helio G90T which was in the Redmi Note 8 Pro, and this put MediaTek back on the map for a performance-orientated chipset. Then there was the Qualcomm Snapdragon 730G which you will find in many phones including the Realme X2 and this was an upper-mid-range gaming orientated chipset.

This year we have seen the launch of mid-range 5G chipsets. The Qualcomm Snapdragon 765G featured in the Chinese Oppo Reno3 Pro and the MediaTek Dimensity 1000L which is found in the Chinese standard Reno3.

Lastly, there has been the Kirin 810, we have not seen it in the UK until recently thanks to the issues with Huawei and the US, but it is another superb chipset sitting in the upper-midrange market.

So how does the MediaTek Helio P95 compare with all these other excellent choices?

CPU – Arm Cortex-A75 vs A76 vs A77

The MediaTek Helio P95 is made on the TSMC 12 nm FinFET process, this is the same as the Mediatek Helio G90t both of which are a step behind the competitors, with the SD730G being on 8nm LPP, then the SD765G being Samsung 7nm EUV (7LPP) and the Kirin 810 also 7nm. Then the Mediatek Dimensity 1000L also uses 7nm

With the Helio P95 you get:

  • 2x Cortex-A75 @ 2.2 GHz
  • 6x Cortex-A55 @ 2GHz

The Dimensity 1000L has more of a flagship spec with the latest Cortex-A77 cores and four big cores with four small cores:

All the other chipsets use a 2×6 arrangement featuring the Cortex-A76 as the big cores

With the Snapdragon 765G you get:

  • 1x Kryo 475 Prime (CA76) @ 2.4GHz
  • 1x Kryo 475 Gold (CA76) @ 2.2GHz
  • 6x Kryo 475 Silver (CA55) @ 1.8GHz

Then stepping down a little you have the Snapdragon 730G with:

  • 2x Kryo 470 (CA76)@ 2.2GHz
  • 6x Kryo 470 (CA55)@ 1.8GHz

The Mediatek Helio G90t has:

  • 2x Cortex A76 @ 2.05GHz
  • 6x Cortex A55 @ 2.0GHz

And finally the Kirin 810 with

  • 2x Cortex-A76 @ 2.23 GHz
  • 6x Cortex-A55 @ 1.88 GHz

For some basic context, the A75 was announced in 2017, according to Arms marketing literature, the A76 has a +35% benchmark uplift from the A76, which was announced in 2018, then the A77 which was announced this past December offers a 20% improvement from the A76.

So if Arms figures and my maths are accurate the A77 should, in theory, offer a 62% improvement over the A75.


Things get more confusing with the GPU specification as we have three completely different GPUs in use.

The MediaTek Helio P95 has the IMG PowerVR GM 9446 @ 970 MHz

Qualcomm use their own Adreno GPU with the SD765G having the Adreno 620 which apparently offer 38% performance improvement over the last generation. Then the SD730G has the Adreno 618.

The Mediatek Helio G90t has a Mali G76 with 4 cores @ 800MHz

And the Huawei/HiSilicon Kirin 810 has Mali G52 with 6 cores @ 820MHz

AI Specification & Benchmarks

Another feature that is difficult to quantify as each company has its own marketing terms for the AI bits of their chipsets.

With the new MediaTek Helio P95, it gets the APU 2.0 which will offer a 10% uplift from the old APU found on the P90.

The Mediatek Helio G90t just states the mix of GPU, CPU and AI engine delivers up to 1 TMACs performance.

Then Qualcomm has the Hexagon 696 plus HVX + Tensor on the SD765G which apparently is capable of 5.4TOPS when combining all the aspects of the phone

From my limited understanding, one MAC equals two FLOP so the Mediatek Helio G90t should be less than half the SD765G

The SD730 has the Hexagon 688 plus HVX and Tensor.

Finally the Kirin 810 with its dual NPU.

For some better context, there is the AI Benchmark website that has the following scores:

  • Oppo Reno3 with Mediatek Dimensity 1000L – 58628
  • Honor 20S with HiSilicon Kirin 810 – 35130
  • Xiaomi Mi Note 10 with SD730G  – 14819
  • Xiaomi Redmi Note 8 Pro with Mediatek Helio G90T – 12908
  • Oppo Reno Z with Mediatek Helio P90 – 26738

The SD765G does not feature on the charts yet.



Geekbench 5 Reno 2Z

The MediaTek Helio P95 has not been benchmarked yet but it should be about the same as the P90 giving it a score of 377 for the single-core and 1474 for the multi-core.

  • MediaTek Helio P95 – 377/1474
  • Snapdragon 765G – 625/1959
  • Snapdragon 730G – 546/1729
  • Mediatek Helio G90t – 504/ 1641
  • Kirin 810 – 576/1851

I am unable to find a Dimensity 1000L Geekbench 5 benchmark.



The SD730G and G90T results are from my testing, while the SD765G is from the claimed Redmi K30 results

  • MediaTek Helio P95 – 162660
  • Snapdragon 765G – 302847
  • Snapdragon 730G – 258311
  • Mediatek Helio G90t – 281295
  • Kirin 810 – 225923

MediaTek Helio P95 vs Snapdragon 765 Snapdragon 765G vs Snapdragon 730 Comparison Table

 MediaTek Helio P95 Snapdragon 765GSnapdragon 730GMediatek Helio G90tKirin 810
ProcessTSMC 12 nm FinFETSamsung
7nm EUV (7LPP)
8nm LPP12nm FinFET7nm
CPU CoresOcta-Core, 64-bitOcta-Core, 64-bit Octa-Core, 64-bitOcta-Core, 64-bitOcta-Core, 64-bit
CPU2x Cortex-A75 @ 2.2 GHz
6x Cortex-A55 @ 2GHz
1x Kryo 475 Prime (CA76)
@ 2.4GHz
1x Kryo 475 Gold (CA76)
@ 2.2GHz
6x Kryo 475 Silver (CA55)
@ 1.8GHz
2x Kryo 470 (CA76)
@ 2.2GHz

6x Kryo 470 (CA55)
@ 1.8GHz
2x Cortex A76 @ 2.05GHz
6x Cortex A55 @ 2.0GHz
2x Cortex-A76 @ 2.23 GHz
6x Cortex-A55 @ 1.88 GHz
GPUIMG PowerVR GM 9446 @ 970 MHzAdreno 620
+38% perf (765G)
Adreno 618Mali G76 MP4 @ 800MHzMali G52MP6 @ 820MHz
DSP / NPUAPU 2.0 (10% improvement)Hexagon 696
HVX + Tensor

(Total CPU+GPU+HVX+Tensor)
Hexagon 688
HVX + Tensor
2x APU

+1TOPs total perf
Dual NPU
RAMLPDDR4x up to 8GB, 1866MHz2x 16-bit CH

@ 2133MHz LPDDR4X / 17.0GB/s
2x 16-bit CH
@ 2133MHz LPDDR4X / 17.0GB/s
LPDDR4x up to 10GB, 2133MHzLPDDR4X @ 2133MHz
CameraSingle 64MP
Dual 24MP + 16MP
Dual 14-bit Spectra 355 ISP

1x 192MP or 36MP with ZSL
2x 22MP with ZSL
Spectra 350
Dual: 22 MP, MFNR, ZSL,30 fps
Single:36 MP, MFNR, ZSL,30 fps
Single: 48 MP, MFNR
Single: 192 MP
Single 64MP and 48MP
Dual 24MP + 16MP
Dual ISP
Video Encode/Decode2160p60 10-bit H.265
HDR10, HDR10+, HLG
2160p30, 1080p120
H.264 & H.265

10-bit HDR pipelines
2160p30, 1080p120
H.264 & H.265

10-bit HDR pipelines
2160p60 10-bit H.265
HDR10, HDR10+, HLG
2160p60 10-bit H.265
HDR10, HDR10+, HLG
ModemLTESnapdragon X52 Integrated

(LTE Category 24/22)
DL = 1200 Mbps
4x20MHz CA, 256-QAM
UL = 210 Mbps
2x20MHz CA, 256-QAM

(5G NR Sub-6 4x4 100MHz
+ mmWave 2x2 400MHz)
DL = 3700 Mbps
UL = 1600 Mbps
Snapdragon X15 LTE

(Category 15/13)
DL = 800Mbps
3x20MHz CA, 256-QAM
UL = 150Mbps
2x20MHz CA, 64-QAM

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