MediaTek D9400 base 2

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MediaTek has officially unveiled the Dimensity 9400, its latest flagship mobile chipset, aimed at pushing the boundaries of smartphone performance, gaming, photography, and artificial intelligence (AI). The launch marks the latest development in MediaTek’s ongoing effort to provide advanced mobile processing power while maintaining a focus on power efficiency. Built using TSMC’s second-generation 3nm process, the Dimensity 9400 aims to deliver a balance between cutting-edge performance and energy efficiency. This article delves into the key specifications, features, and broader implications of the new chipset.

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Dimensity 9400 vs Dimensity 9300: Specification Comparison

Mediatek Dimensity 9400
FeatureDimensity 9400Dimensity 9300
CPU Configuration1x Cortex-X925 @ 3.62GHz, 3x Cortex-X4, 4x Cortex-A7201x Cortex-X3, 3x Cortex-A715, 4x Cortex-A510
Manufacturing ProcessTSMC 3nm (2nd Gen)TSMC 3nm (1st Gen)
Single-Core Performance Boost+35%
Multi-Core Performance Boost+28%
L2 Cache100% more than Dimensity 9300Base
L3 Cache50% more than Dimensity 9300Base
GPUArm Immortalis-G925 (12-core)Arm Mali-G715
GPU Performance+41% peak, +40% raytracing performance
Power Efficiency Improvement+40%
NPU Generation8th Generation7th Generation
AI Performance+80% LLM prompt performance, +100% diffusion generationBase
Video Capture4K60, -14% power consumption4K60
Connectivity5G/4G DSDA, Wi-Fi 7, 4nm Wi-Fi/Bluetooth combo chip5G DSDA, Wi-Fi 6E
Wi-Fi Data RateUp to 7.3GbpsUp to 4.8Gbps
Bluetooth RangeUp to 1.5kmStandard
Display SupportTri-fold smartphone supportNo

Performance Boost and Architectural Evolution

The Dimensity 9400 is built upon the second-generation All Big Core design, which features one Cortex-X925 core clocked at 3.62GHz, along with three Cortex-X4 cores and four Cortex-A720 cores. This arrangement provides a considerable upgrade in both single-core and multi-core performance over its predecessor, the Dimensity 9300. Specifically, single-core performance is boosted by 35%, and multi-core performance sees a 28% improvement, thanks to increased cache and architectural refinements. The chipset also boasts a 40% improvement in power efficiency compared to the previous generation, an achievement made possible by the use of TSMC’s advanced 3nm manufacturing process.

MediaTek has doubled down on cache memory, equipping the Dimensity 9400 with 100% more L2 cache and 50% more L3 cache compared to its predecessor. This increased memory availability helps to streamline data processing and ensures that the CPU cores can operate without bottlenecks during demanding tasks.

AI and the Next Step in Generative Applications

A standout feature of the Dimensity 9400 is its advanced 8th Generation Neural Processing Unit (NPU), which powers a wide range of AI-based functionalities. The Dimensity Agentic AI Engine makes its debut with this chipset, bringing agentic AI capabilities to smartphones for the first time. This allows devices to become more responsive and capable of handling sophisticated AI applications. The AI performance is particularly noteworthy in natural language processing (NLP) tasks, with up to 80% faster prompt processing and a doubling in diffusion generation performance compared to the previous generation.

One of the most intriguing AI advancements enabled by the Dimensity 9400 is on-device LoRA (Low-Rank Adaptation) training, a feature previously restricted to more computationally powerful systems. This means that smartphones can now perform on-device training, enabling a new class of applications that can learn and adapt directly on the device, offering greater privacy and reduced latency.

Additionally, the chipset supports high-quality on-device video generation, and MediaTek has partnered with developers to build a growing ecosystem of generative AI and agentic applications, which could broaden the role that AI plays in everyday smartphone usage.

Gaming Prowess with the Immortalis-G925 GPU

The gaming capabilities of the Dimensity 9400 are spearheaded by the 12-core Arm Immortalis-G925 GPU. This GPU is designed to offer a superior gaming experience, with up to 40% improved raytracing performance, a 41% peak performance boost, and 44% power savings when compared to its predecessor. The incorporation of advanced features such as opacity micromaps (OMM) support ensures that visual effects in games are both realistic and immersive.

In collaboration with Arm, MediaTek has also introduced HyperEngine technology, which uses Super Resolution co-developed with Arm’s Accurate Super Resolution (ASR) to deliver enhanced picture quality. The Dimensity 9400 includes the MediaTek Frame Rate Converter and Adaptive Gaming Technology (MAGT) 3.0, which ensures smoother frame rates and optimised power consumption for an extended gaming experience.

Photography and Videography Enhancements

Photography enthusiasts are likely to appreciate the MediaTek Imagiq 1090 ISP integrated within the Dimensity 9400. The ISP brings a set of sophisticated photography features, including HDR video recording across the entire zoom range and MediaTek’s Smooth Zoom technology, which is designed to minimise the power consumption of 4K60 video capture. Compared to the Dimensity 9300, video recording at 4K60 consumes 14% less power, an important aspect for those who want to capture high-quality video without worrying about rapid battery drain.

Generative AI Super Zoom, another feature powered by the advanced NPU, allows for high-quality image capture even when using digital zoom. This technology works in tandem with AI-based noise reduction and dynamic range optimisation, ensuring that users can take well-balanced and sharp photos even in challenging lighting conditions.

Enhanced Connectivity and Compatibility

With the evolution of connectivity standards, MediaTek has integrated the refreshed 3GPP Release-17 5G modem into the Dimensity 9400, which supports 4CC carrier aggregation and up to 7Gbps sub-6GHz performance. This results in improved connectivity even in less favourable conditions, ensuring that users maintain a stable and fast network connection in a wide variety of environments. The chipset also offers 5G/4G Dual SIM Dual Active (DSDA) capability, giving users more flexibility in managing connectivity.

Support for Wi-Fi 7 has also been included, which allows for tri-band MLO (Multi-Link Operation) and data rates up to 7.3Gbps. The new 4nm Wi-Fi/Bluetooth combo chip uses up to 50% less power compared to the previous generation and extends Wi-Fi coverage by 30 metres using MediaTek Xtra Range 3.0 technology. Bluetooth connections can also be established over distances up to 1.5 kilometres between devices, a considerable improvement over previous standards.

Sound and Multimedia Capabilities

In addition to its strong performance and AI capabilities, the Dimensity 9400 also focuses on delivering an enhanced multimedia experience. The chipset provides support for up to 24-bit/384KHz Bluetooth audio, a feature aimed at audiophiles who demand high-quality sound. With up to six microphones, the chipset is designed to capture 24-bit audio recordings, with the AI Audio Focus feature helping to eliminate sudden and unwanted noises.

These multimedia advancements contribute to a richer and more immersive experience for users, whether they are watching videos, gaming, or making video calls. The improved audio and video quality combine to make the Dimensity 9400 a solid choice for consumers who use their smartphones as entertainment hubs.

Power Efficiency and Practical Considerations

Power efficiency is a key consideration for MediaTek, as evidenced by the Dimensity 9400’s power management improvements over the Dimensity 9300. Built on the second-generation 3nm process, the chipset utilises MediaTek’s UltraSave 4.0 technology, which contributes to overall power savings of up to 40%. The AI Network Suite 2.0 and AI UAC 3.0 further optimise energy use, helping to deliver power-efficient AI processing and connectivity. For users, these enhancements translate into longer battery life, even when performing demanding tasks such as gaming or video recording.

The Dimensity 9400 is also ready to support next-generation foldable smartphones. It features tri-fold display support via three MIPI-DSI interfaces, enabling device manufacturers to create versatile designs and new form factors. This support will likely facilitate the development of larger displays without compromising the portability of devices, giving manufacturers an opportunity to innovate and differentiate their products.

Conclusion

MediaTek’s Dimensity 9400 SoC represents a major advancement in the mobile chipset market, with substantial improvements in performance, AI capabilities, gaming, photography, and connectivity. By enhancing power efficiency, supporting advanced AI applications, and offering sophisticated gaming and multimedia experiences, MediaTek aims to compete directly with other high-end mobile SoCs available in the market.

The inclusion of advanced features such as on-device LoRA training, agentic AI, and support for trifold smartphones illustrates MediaTek’s intention to push the boundaries of what smartphones are capable of. As the first devices powered by the Dimensity 9400 become available towards the end of 2024, the mobile landscape is set for significant advancements, with a focus on AI-driven user experiences and sustained performance.

For users, this means a more responsive, intelligent, and efficient smartphone experience, while for device manufacturers, the Dimensity 9400 opens doors for more creative and innovative designs. MediaTek’s efforts with the Dimensity 9400 show its commitment to delivering a balance of power, efficiency, and cutting-edge features, reinforcing its place in the competitive mobile chipset landscape.

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