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MediaTek, a leading semiconductor company, has announced the launch of the Dimensity 7300 and Dimensity 7300X, two ultra-efficient 4nm chips designed for high-tech mobile devices, including smartphones and foldables. These new chipsets promise to deliver best-in-class power efficiency, superior performance, and enhanced features for multitasking, photography, gaming, and AI-enhanced computing.
Key Features and Improvements
The Dimensity 7300 and Dimensity 7300X are built using a 4nm process, which provides up to 25% lower power consumption in the Arm Cortex-A78 cores compared to the Dimensity 7050. The octa-core CPU consists of 4X Arm Cortex-A78 cores operating at up to 2.5 GHz and 4X Arm Cortex-A55 cores. This configuration, combined with the latest Arm Mali-G615 GPU and MediaTek HyperEngine optimizations, accelerates gaming experiences by 20% in terms of frames per second (FPS) and improves energy efficiency by 20% compared to competitor alternatives.
Enhanced Gaming Experience
The new chips utilize smart resource optimisation, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio. This results in a seamless gaming experience with reduced latency and improved audio quality.
Upgraded Photography
The Dimensity 7300 chipsets feature the MediaTek Imagiq 950, a premium-grade 12-bit HDR-ISP with support for a 200MP main camera. Enhanced with new hardware engines providing precise noise reduction (MCNR), face detection (HWFD), and video HDR, the Dimensity 7300 lets users capture stunning images and videos in any lighting. Live focus photo performance is up to 1.3X faster, and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range compared to competitor solutions, bringing out more details in videos.
AI Enhancements
The MediaTek APU 655 significantly boosts AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips also accommodate new mixed precision data types to more efficiently utilize memory bandwidth and reduce memory requirements for larger AI models.
Display and Connectivity
The Dimensity 7300 SoCs support impressively detailed WFHD+ displays with 10-bit true color, along with support for global HDR standards, enhancing media streaming and playback. The dedicated support for dual display flip phones on the Dimensity 7300X makes it easier for OEMs to meet the growing market demand for innovative form factors. Additionally, the chipsets feature tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity and dual 5G SIM support with dual VoNR to give users more choice.
Power Efficiency and 5G Capabilities
MediaTek’s 5G UltraSave 3.0+ technology incorporates a complete suite of R16 power saving enhancements, plus MediaTek’s own optimizations that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6 GHz connectivity scenarios. The chipsets also support up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments.
Specification Table
| Processor | Dimensity 7300 / 7300X | Dimensity 7050 |
|---|---|---|
| Process | 4nm-class | TSMC 6nm-class |
| CPU | 4x Cortex-A78 @ 2.5 GHz 4x Cortex-A55 @ 2 GHz | 4x Cortex-A78 @ 2.6 GHz 4x Cortex-A55 @ 2 GHz |
| Memory | LPDDR5 / LPDDR4x up to 6400Mbps, UFS 3.1 | LPDDR5 / LPDDR4x, UFS 3.1 / UFS 2.1 |
| Camera | Imagiq 950 ISP, 12-bit HDR-ISP, Hardware Face Detection, Hardware MCNR, 4K Video HDR AI-3A with AE, AWB, AF, Video EIS, Dual simultaneous video capture, All-pixel AF | Imagiq ISP, Max Camera ISP 200MP, Hardware MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine |
| Display | WFHD+ @ 120Hz, Full HD+ @ 144Hz, Dual display support (7300X) | 2520 x 1080 at 120Hz |
| Video Playback / Video Encode | H.264, HEVC, VP-9 | HEVC, H.264 |
| Graphics | Arm Mali-G615 MC2 | Arm Mali-G6 8 MC4 |
| APU | MediaTek 6th generation APU 655 | MediaTek APU 3.0 |
| Modem | 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A(SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA SA & NSA modes; SA Option 2, NSA Option3/3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC 140MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 ULEnhancement, 2 M 2 MIMO, 256QAM VoNR / EPS fallback | 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A(SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA SA & NSA modes; SA Option 2, NSA Option3/3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC 140MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 ULEnhancement, 2 M 2 MIMO, 256QAM VoNR / EPS fallback |
| Connectivity | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.4, GPS BeiDou Glonass Galileo QZSS NavIC | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.4, GPS BeiDou Glonass Galileo QZSS NavIC |
I am James, a UK-based tech enthusiast and the Editor and Owner of Mighty Gadget, which I’ve proudly run since 2007. Passionate about all things technology, my expertise spans from computers and networking to mobile, wearables, and smart home devices.
As a fitness fanatic who loves running and cycling, I also have a keen interest in fitness-related technology, and I take every opportunity to cover this niche on my blog. My diverse interests allow me to bring a unique perspective to tech blogging, merging lifestyle, fitness, and the latest tech trends.
In my academic pursuits, I earned a BSc in Information Systems Design from UCLAN, before advancing my learning with a Master’s Degree in Computing. This advanced study also included Cisco CCNA accreditation, further demonstrating my commitment to understanding and staying ahead of the technology curve.
I’m proud to share that Vuelio has consistently ranked Mighty Gadget as one of the top technology blogs in the UK. With my dedication to technology and drive to share my insights, I aim to continue providing my readers with engaging and informative content.
