Mediatek Dimensity 8300 scaled

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MediaTek has unveiled its latest chipset, the Dimensity 8300, designed to enhance the premium 5G smartphone experience significantly. This new chipset is a testament to MediaTek’s commitment to pushing the boundaries of mobile technology, offering a combination of high performance, energy efficiency, and cutting-edge features.

Unmatched Performance and Efficiency

Mediatek Dimensity 8300 Spec

The Dimensity 8300, built on TSMC’s 2nd generation 4nm process, features an octa-core CPU comprising four Arm Cortex-A715 cores and four Cortex-A510 cores. This architecture, based on Arm’s latest v9 CPU architecture, delivers a 20% increase in CPU performance and 30% peak gains in power efficiency over its predecessor, the Dimensity 8200. The chipset’s Mali-G615 MC6 GPU upgrade further enhances performance, boasting up to 60% greater performance and 55% better power efficiency.

AI and Gaming Capabilities

A standout feature of the Dimensity 8300 is the MediaTek APU 780 processor, marking a significant advancement in generative AI capabilities. This enables up to 8x faster transformer-based generative AI, a 2x improvement in integer and floating-point compute, and up to 10 billion parameters for AI applications. The chipset also includes MediaTek Adaptive Game Technology 2.0, designed to optimize gaming experiences through real-time frame rate control algorithms.

Video and Display Enhancements

MediaTek’s focus on multimedia experiences is evident in the Dimensity 8300’s capability to capture 4K60 HDR video with 10% more power efficiency than previous generations. The chipset supports up to 120Hz WQHD+ and 180Hz Full HD+ displays, HDR10+ Adaptive support, and features like Smart BluLight Defender and AI-Color Content Smart ISP.

Networking and Connectivity

The Dimensity 8300 integrates the latest 3GPP Release-16 standard 5G modem, offering up to 5.17Gbps downlink speeds. It also features MediaTek 5G UltraSave 3.0+, which enhances 5G power efficiency by up to 20%. Additionally, the chipset supports Wi-Fi 6E with double the bandwidth of the previous generation and MediaTek Wi-Fi/Bluetooth hybrid coexistence technology.

Comparison with Dimensity 8200

Mediatek Dimensity 8300 CPU and GPU
SpecificationDimensity 8300Dimensity 8200
Process Technology4nm4nm
CPUOcta-core (4x Cortex-A715, 4x Cortex-A510)Octa-core (1×3.1 GHz Cortex-A78 & 3×3.0 GHz Cortex-A78 & 4×2.0 GHz Cortex-A55)
GPUMali-G615 MC6Mali-G610 MC6
AI CapabilitiesAPU 780 (8x faster AI, 3.3x AI performance)APU 580
Memory SupportLPDDR5X up to 8533MbpsLPDDR5 (up to 6,400 Mbps)
Storage SupportUFS 4.0 + MCQUFS 3.1
5G Modem3GPP Release-16, Up to 5.17Gbps4.7 Gbps downlink
Power EfficiencyUp to 30% Peak GainsPrevious Generation
Video Capture4K60 HDR, Enhanced Power Efficiency4K @ 60 fps (HDR10+)
Display Support120Hz WQHD+/180Hz Full HD+FHD+ @ 180Hz, WQHD+ @ 120Hz
ConnectivityWi-Fi 6E 160BW, Bluetooth 5.4Wi-Fi 6E (2×2) BT 5.3

Performance Improvements

The Dimensity 8300 demonstrates substantial improvements across various domains:

  • CPU Performance: A 20% increase in CPU performance.
  • GPU Performance: Up to 60% greater performance.
  • Power Efficiency: 30% peak gains in efficiency, with a more power-efficient 4K60 video capture.
  • Networking: Enhanced 5G capabilities with up to 5.17Gbps downlink speeds and improved Wi-Fi 6E performance.


The MediaTek Dimensity 8300 is set to power 5G devices launching globally by the end of 2023. Its introduction marks a significant leap in smartphone technology, promising to deliver exceptional performance, AI capabilities, and connectivity to the premium 5G smartphone segment. With its advanced features and improvements over the previous generation, the Dimensity 8300 is poised to redefine what users can expect from their premium 5G smartphones.

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