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As expected, today MediaTek announced the Dimensity 820. The previous leaks have been confirmed; this new chipset offers a significant CPU boost taking the four Arm Coretex A76 cores up to 2.6Ghz. This represents a 30% boost in frequencies which eclipses the improvements Qualcomm made to their SD765G when they revamped it as the SD768G.

Looking at the spec sheet, it looks like Mediatek has added an extra GPU core to the chipset too. The MediaTek Dimensity 800 is stated as having Arm Mali-G57 MC4 while the new Dimensity 820 is running Arm Mali-G57 MC5

MediaTek Dimensity 820MediaTek Dimensity 800Qualcomm Snapdragon 768G
Main CPU4x Cortex A76 @ 2.0GHz4x Cortex A76 @ 2.6GHz1x Cortex A76 @ 2.8GHz
1x Cortex-A76 @ 2.4GHz
Efficient CPU4x Cortex A55 @ 2.0GHz4x Cortex A55 @ 2.0GHz6x Cortex-A55 @ 1.8GHz
GPUArm Mali-G57 MC5 (25% increase?)Arm Mali-G57 MC4Adreno 620 (15% boost in performance vs SD765G
Sorry about the poor resolution, this was all that was available on the PR

I would expect this to be the most powerful mid-range chipset, we just need to see a company implement it. It is currently expected that the Xiaomi Redmi Note 10 series will be the first devices to use it.

Dr. Yenchi Lee, Assistant General Manager of MediaTek’s Wireless Communications Business Unit.  “The Dimensity 820 stands out beyond competitors by offering four high-performance Arm Cortex-A76 cores at 2.6GHz within its octa-core CPU, delivering superb performance and responsiveness, among its incredible AI, gaming and photography experiences.”

The chipset will also offer support for 120Hz high frame-rate displays and HDR.

MediaTek’s Dimensity 820 integrates a 5G NR (sub-6GHz) modem into this single-chip solution with MediaTek’s 5G UltraSave technologies, including exclusive 5G UltraSave Network Environment Detection and 5G UltraSave OTA Content Awareness, that altogether provides best-in-class energy efficiency. The 5G modem design also uses dynamic bandwidth part (BWP) adaption and connected mode discontinuous reception (C-DRX) power-saving technologies.

5G Carrier Aggregation (CA) technology delivers higher average speeds and a seamless handover between two 5G connection areas for the most reliable connectivity on the go. The Dimensity 820 also supports dual SIM, dual standby (DSDS) 5G technology for access to the fastest speeds and Voice over New Radio (VoNR) services on both SIMs.

The MediaTek Dimensity 820 press release has a bunch of features it includes, but as far as I am away these are all identical to the Dimensity 800, so we are just seeing a boost in CPU clocks.

  • Dedicated APU 3.0 (AI Processing Unit): MediaTek APU 3.0 provides more powerful AI-camera capabilities so users can capture stunning images and videos at the same time, without any quality loss.
  • HyperEngine 2.0 gaming technologies: MediaTek’s HyperEngine 2.0 provides whole smartphone enhancements for gaming. Combined with the chipset’s premium five-core GPU it delivers a superb gaming experience with optimizations that reduce network latency for smoother gameplay, support faster response times and enhance display quality. HyperEngine 2.0 also intelligently adjusts the CPU, GPU and memory resources to optimize power and performance.
  • MediaTek’s Imagiq 5.0: The flagship-class, HDR-native image signal processor (ISP) supports up to four concurrent cameras and up to 80MP sensors, giving brands more design flexibility.
  • Multi-frame 4K Video HDR: Easily to record stunning 4K HDR video even in bright and dark environments. The chip automatically captures frames at different exposures and intelligently fuses them into a single video stream, all in real-time.

The Dimensity 820 delivers best in class 5G Experiences, featuring the latest MediaTek technologies, bringing impressive big core performance to premium experience devices.

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