MediaTek Unveils Dimensity 7300 and Dimensity 7300X: Power-Efficient Chips for High-Tech Smartphones and Foldables
|

MediaTek Unveils Dimensity 7300 and Dimensity 7300X: Power-Efficient Chips for High-Tech Smartphones and Foldables

ByJames Smythe

MediaTek, a leading semiconductor company, has announced the launch of the Dimensity 7300 and Dimensity 7300X, two ultra-efficient 4nm chips designed for high-tech mobile devices, including smartphones and foldables. These new chipsets promise to deliver best-in-class power efficiency, superior performance, and enhanced features for multitasking, photography, gaming, and AI-enhanced computing. Key Features and Improvements The…

MediaTek Unveils Dimensity 9300+ SoC for Flagship Smartphones
|

MediaTek Unveils Dimensity 9300+ SoC for Flagship Smartphones

ByJames Smythe

MediaTek has announced the release of its latest flagship mobile chip, the Dimensity 9300+. This new System-on-Chip (SoC) is designed to enhance the performance of high-end smartphones, with a particular focus on accelerating on-device generative AI processing and supporting larger language models (LLMs). The Dimensity 9300+ is built on TSMC’s 3rd generation 4nm process and…

MediaTek Unveils Dimensity Auto Cockpit Chipsets with Advanced AI Capabilities
|

MediaTek Unveils Dimensity Auto Cockpit Chipsets with Advanced AI Capabilities

ByJames Smythe

MediaTek has announced the launch of four new automotive systems-on-chip (SoCs) within its Dimensity Auto Cockpit portfolio at NVIDIA GTC. The new chipsets, named Dimensity Auto Cockpit CX-1, CY-1, CM-1, and CV-1, are designed to offer powerful AI in-cabin experiences for the next generation of intelligent vehicles, spanning from premium to entry-level segments. The Dimensity…

MediaTek T300 5G RedCap Platform Announced: Extremely Low Power, Compact Wearables and IoT Devices

MediaTek T300 5G RedCap Platform Announced: Extremely Low Power, Compact Wearables and IoT Devices

ByJames Smythe

At MWC 2024, MediaTek has announced the T300 which is the is the latest addition to their 5G RedCap range, designed for wearables and IoT devices where low power draw is essential. It packs in their M60 modem to bring 5G connectivity through the 3GPP Release 17 standard, offering major gains over existing 4G solutions….

MediaTek to Demo On-Device Generative AI with Llama 2 at MWC 2024

MediaTek to Demo On-Device Generative AI with Llama 2 at MWC 2024

ByJames Smythe

MediaTek has announced it will be showcasing on-device generative AI using Llama 2, Meta’s open-source large language model (LLM), at next week’s Mobile World Congress 2024 in Barcelona. The demo will highlight MediaTek’s latest Dimensity 9300 and 8300 system-on-chips (SoCs) running an optimized version of Llama 2 for the first time. What is a Large…

MediaTek and Google Collaborate on New Filogic Smart Home Chipset with Wi-Fi, Bluetooth, Thread and Matter Support
| |

MediaTek and Google Collaborate on New Filogic Smart Home Chipset with Wi-Fi, Bluetooth, Thread and Matter Support

ByJames Smythe

At CES 2024, MediaTek, a leading fabless semiconductor company, has announced a new collaboration with Google to develop a multi-radio chipset solution supporting Thread, Wi-Fi, Bluetooth and Matter for smart home devices. The chipset aims to enable faster and more reliable connections between devices from different manufacturers and ecosystems. Related Content New Filogic Chipset Combines…

MediaTek Dimensity 8300 Announced – With upto 60% increase in GPU performance vs Dimensity 8200
|

MediaTek Dimensity 8300 Announced – With upto 60% increase in GPU performance vs Dimensity 8200

ByJames Smythe

MediaTek has unveiled its latest chipset, the Dimensity 8300, designed to enhance the premium 5G smartphone experience significantly. This new chipset is a testament to MediaTek’s commitment to pushing the boundaries of mobile technology, offering a combination of high performance, energy efficiency, and cutting-edge features. Unmatched Performance and Efficiency The Dimensity 8300, built on TSMC’s…

MediaTek Unveils RedCap Chipsets to Bring Efficient 5G Connectivity to IoT Devices

MediaTek Unveils RedCap Chipsets to Bring Efficient 5G Connectivity to IoT Devices

ByJames Smythe

MediaTek has unveiled a new era in 5G technology with its introduction of the RedCap solutions, including the world’s first Modem-RF System-On-Chip (SoC) for 5G IoT and wearables, the MediaTek M60. Aimed at transforming the IoT landscape, this breakthrough promises to deliver impressive 5G data rates combined with exceptional power efficiency across various devices. The…

MediaTek Expands Cutting-Edge Wi-Fi 7 Chipset Portfolio with Filogic 860 and Filogic 360 Chipsets
|

MediaTek Expands Cutting-Edge Wi-Fi 7 Chipset Portfolio with Filogic 860 and Filogic 360 Chipsets

ByJames Smythe

MediaTek has expanded its Wi-Fi 7 portfolio with the introduction of its new Filogic 860 and Filogic 360 chipsets. This launch marks a significant step forward in providing mainstream devices with cutting-edge wireless technology that promises peak performance and unrivalled reliability. Introducing Filogic 860 and Filogic 360 The company’s leap into second-generation Wi-Fi 7 technology…

A Comprehensive History of MediaTek

A Comprehensive History of MediaTek

ByJames Smythe

With the MediaTek Executive Summit upon us, this post aims to cover the history of Mediatek and their rise to become a key player in the world of system-on-chips. In this comprehensive exploration, we will delve into MediaTek’s notable acquisitions, financial performance, and their remarkable range of chipsets tailored for smartphones, Chromebooks & tablets, smart…

MediaTek Announces Dimensity 9300 Chipset with Qualcomm Snapdragon 8 Gen 3 Beating Claims
|

MediaTek Announces Dimensity 9300 Chipset with Qualcomm Snapdragon 8 Gen 3 Beating Claims

ByJames Smythe

MediaTek has announced its newest flagship mobile chipset, the Dimensity 9300, which the company claims delivers performance that beats Qualcomm’s recently announced Snapdragon 8 Gen 3 chipset. The Dimensity 9300 features an innovative “All Big Core” CPU design and upgraded AI capabilities for enhanced performance. All Big Core Design for More Powerful Computing The Dimensity…

MediaTek Dimensity 6100+ Chipset Announced providing incremental improvements vs Dimensity 810
|

MediaTek Dimensity 6100+ Chipset Announced providing incremental improvements vs Dimensity 810

ByJames Smythe

MediaTek has announced a new chipset for mid-range 5G devices. The new chipset appears to rehash the existing technology. Based on the specification that we know, this is basically the Dimensity 810 with improved 5G and the max camera resolution increased to 108MP. Both chips have the same CPU with: Then they are both listed…

End of content

End of content