MediaTek has officially announced the Dimensity 9400+, an upgraded version of its Dimensity 9400 chipset, designed to deliver enhanced performance for flagship smartphones. The new processor incorporates advanced artificial intelligence (AI) capabilities, improved efficiency, and cutting-edge gaming features, making it a notable addition to MediaTek’s portfolio of mobile chipsets. Enhanced Performance with All Big Core…
The Redmi Note 14 has just been launched, and I have used it for the past few weeks. I am quite impressed with this incredibly affordable phone. You should be aware that the Redmi Note 14 series is a bit of a confusing lineup. There are already a lot of reviews for the Redmi Note…
Most laptops and desktops use a removable WiFi module that you can upgrade as new WiFi standards come out. Or alternatively, for desktops, you can use a PCIe adaptor like this TP-Link Archer TBE550E. Back in the days of WiFi 5, you had a choice of Intel, Realtek and Killer. With WiFi 6 and WiFi…
MediaTek, a leading semiconductor company, has announced the launch of the Dimensity 7300 and Dimensity 7300X, two ultra-efficient 4nm chips designed for high-tech mobile devices, including smartphones and foldables. These new chipsets promise to deliver best-in-class power efficiency, superior performance, and enhanced features for multitasking, photography, gaming, and AI-enhanced computing. Key Features and Improvements The…
MediaTek has announced the release of its latest flagship mobile chip, the Dimensity 9300+. This new System-on-Chip (SoC) is designed to enhance the performance of high-end smartphones, with a particular focus on accelerating on-device generative AI processing and supporting larger language models (LLMs). The Dimensity 9300+ is built on TSMC’s 3rd generation 4nm process and…
MediaTek has announced the launch of four new automotive systems-on-chip (SoCs) within its Dimensity Auto Cockpit portfolio at NVIDIA GTC. The new chipsets, named Dimensity Auto Cockpit CX-1, CY-1, CM-1, and CV-1, are designed to offer powerful AI in-cabin experiences for the next generation of intelligent vehicles, spanning from premium to entry-level segments. The Dimensity…
At MWC 2024, MediaTek has announced the T300 which is the is the latest addition to their 5G RedCap range, designed for wearables and IoT devices where low power draw is essential. It packs in their M60 modem to bring 5G connectivity through the 3GPP Release 17 standard, offering major gains over existing 4G solutions….
MediaTek has announced it will be showcasing on-device generative AI using Llama 2, Meta’s open-source large language model (LLM), at next week’s Mobile World Congress 2024 in Barcelona. The demo will highlight MediaTek’s latest Dimensity 9300 and 8300 system-on-chips (SoCs) running an optimized version of Llama 2 for the first time. What is a Large…
At CES 2024, MediaTek, a leading fabless semiconductor company, has announced a new collaboration with Google to develop a multi-radio chipset solution supporting Thread, Wi-Fi, Bluetooth and Matter for smart home devices. The chipset aims to enable faster and more reliable connections between devices from different manufacturers and ecosystems. Related Content New Filogic Chipset Combines…
MediaTek has unveiled its latest chipset, the Dimensity 8300, designed to enhance the premium 5G smartphone experience significantly. This new chipset is a testament to MediaTek’s commitment to pushing the boundaries of mobile technology, offering a combination of high performance, energy efficiency, and cutting-edge features. Unmatched Performance and Efficiency The Dimensity 8300, built on TSMC’s…
MediaTek has unveiled a new era in 5G technology with its introduction of the RedCap solutions, including the world’s first Modem-RF System-On-Chip (SoC) for 5G IoT and wearables, the MediaTek M60. Aimed at transforming the IoT landscape, this breakthrough promises to deliver impressive 5G data rates combined with exceptional power efficiency across various devices. The…
MediaTek has expanded its Wi-Fi 7 portfolio with the introduction of its new Filogic 860 and Filogic 360 chipsets. This launch marks a significant step forward in providing mainstream devices with cutting-edge wireless technology that promises peak performance and unrivalled reliability. Introducing Filogic 860 and Filogic 360 The company’s leap into second-generation Wi-Fi 7 technology…
End of content
End of content