Qualcomm is currently holding their annual Snapdragon Tech Summit where they will gradually reveal the full details of the up and coming technology for mobile in the following year.
They key parts of the summit (for consumers) is the announcement of the latest chipsets to feature in our phones. The first day has not revealed a great deal, Qualcomm has confirmed the Qualcomm Snapdragon 865 and that it lacks an integrated 5G mode, they have also revealed some details about the Snapdragon 765 and 765G, but not the full specs.
So what do we know so far?
The 5G mid-range chipset has been rumoured for a while now, and Qualcomm announced they would launch one back at IFA. It was previously leaked as being called the Qualcomm Snapdragon 735. It is expected that the previous specification leaks were accurate but lets stick with what we know first.
The stand out feature is obviously the integrated 5G modem which will be the X52 vs the LTE X15 on the Snapdragon 730. While this is not as good as the full-fat X55 you will find on the Qualcomm Snapdragon 865, it is still capable of up to 3.7 Gbps download speeds with support for mmWave, Sub 6 GHz, Dynamic Spectrum Sharing, NSA, SA, and carrier aggregation. Qualcomm has designed these chips to be ‘global’ and support as much of the current and future 5G infrastructure as possible.
GPU, Imaging & AI upgrade
Qualcomm has not revealed details of the exact specification, but one of the slides in the presentation revealed the new chipset will feature an upgraded GPU with the Adreno 620, the AI processor has been upgraded to the Hexagon 696 and the imaging processor is now the Spectra 355.
Those are just names though and they don’t give much away about performance. The only hints we got were 4K HDR capture and the 5th generation AI Engine being capable of 5 TOPS.
The Snapdragon 765 and 765G will be similar to the last generation with the G model being higher performance.
Rumoured CPU Specification
Moving to the rumoured specification. It is very likely that the new Snapdragon 765 will stick to the custom Arm Coretex A76 and A55 cores. The new chipset is expected to be manufactured on the 7nm fabrication process, and this year it is a 1x1x6 layout with one Arm Coretex A76 running at 2.36GHz and the other running at 2.32. Then the A55 cores maybe 1.73GHz.
The accuracy of the leaks for frequencies of the clocks remains unknown, it would be odd to have the A55 cores clocked lower than last year.
|Qualcomm Snapdragon 765||Qualcomm Snapdragon 730G|
|Fabrication Process||7nm||8nm LPP|
|CPU||1x Kryo 475 Prime (CA76)|
@ 2.3GHz (non-G)
@ 2.4GHz (765G)
1x Kryo 475 Gold (CA76)
6x Kryo 475 Silver (CA55)
|2x Kryo 470 (CA76)
6x Kryo 470 (CA55)
+20% perf (non-G)
+38% perf (765G)
HVX + Tensor
|Hexagon 688 Processor
|Imaging||Dual 14-bit Spectra 355 ISP|
1x 192MP or 36MP with ZSL
2x 22MP with ZSL
|Qualcomm Spectra 350 / Dual 14-bit ISPs|
|Modem||Snapdragon X52 Integrated|
(LTE Category 24/22)
DL = 1200 Mbps
4x20MHz CA, 256-QAM
UL = 210 Mbps
2x20MHz CA, 256-QAM
(5G NR Sub-6 4x4 100MHz
+ mmWave 2x2 400MHz)
DL = 3700 Mbps
UL = 1600 Mbps
|Snapdragon X15 LTE
DL = 800Mbps
3x20MHz CA, 256-QAM
UL = 150Mbps
2x20MHz CA, 64-QAM