Qualcomm Snapdragon

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[Update] It had been previously leaked that the new integrated 5G Qualcomm chipset would be called the Qualcomm Snapdragon 735. Today Qualcomm has now announced the Snapdragon 765 and Snapdragon 765G.

Currently, Qualcomm has not announced the full specification of the Snapdragon 735, but one of the slides confirmed that the new SoC will feature the Andreno 620 GPU, as well as the Spectra 355 ISP, and Hexagon 696 Processor. It is still expected that the CPU specification will be the same as below, sticking to the Coretex A76 and A55 CPU cores but with higher clocks than the last generation.

Qualcomm Snapdragon 735

The Qualcomm Snapdragon 735 was leaked all the way back in April, and at IFA Qualcomm announced they would be launching an affordable 5G chipset based on the Snapdragon 700-series, which presumably would be the SD735.

In recent days Realme, OPPO and Nokia have all been reported as having an affordable 5G phone in the works and expected to launch before the year is out.

It is expected that Qualcomm will announce the new chipset either ion November or December but in the meantime, new information has leaked which contradict earlier specifications. The internal codename of the chipset has been reported as SM7250 and the expected name was Snapdragon 735, but it has now confirmed to be the Snapdragon 765.

The previous leak stated that there will be 1 Kryo Prime core running at 2.9GHz, 1 Kryo core at 2.4GHz and 6 Kryo cores at 1.8GHz. The GPU is going to be upgraded to Adreno 620 with a max frequency of 750MHz.

The new leak has more conservative numbers with the CPU configuration set as  1x Cortex A76 @ 2.36GHz + 1x Cortex A76 @ 2.32GHz + 6x Cortex A55 @ 1.73GHz. This information is perhaps a little more believable as it indicates a small performance improvement with the two higher clocked cores being at a higher frequency than the Snapdragon 730G. This should be boosted by improvement with the GPU moving from Adreno 618 to Adreno 620.

The higher frequencies will be achieved thanks to the lower fabrication processes giving more headroom with thermals and power efficiency.

Qualcomm Snapdragon 765Qualcomm Snapdragon 730G
Fabrication Process7nm8nm LPP
CPU1x Kryo 475 Prime (CA76)
@ 2.3GHz (non-G)
@ 2.4GHz (765G)
1x Kryo 475 Gold (CA76)
@ 2.2GHz
6x Kryo 475 Silver (CA55)
@ 1.8GHz
2x Kryo 470 (CA76)
@ 2.2GHz
6x Kryo 470 (CA55)
@ 1.8GHz
GPUAdreno 620
+20% perf (non-G)
+38% perf (765G)
Adreno 618
AIHexagon 696
HVX + Tensor

(Total CPU+GPU+HVX+Tensor)
Hexagon 688 Processor
ImagingDual 14-bit Spectra 355 ISP

1x 192MP or 36MP with ZSL
2x 22MP with ZSL
Qualcomm Spectra 350 / Dual 14-bit ISPs
ModemSnapdragon X52 Integrated

(LTE Category 24/22)
DL = 1200 Mbps
4x20MHz CA, 256-QAM
UL = 210 Mbps
2x20MHz CA, 256-QAM

(5G NR Sub-6 4x4 100MHz
+ mmWave 2x2 400MHz)
DL = 3700 Mbps
UL = 1600 Mbps
Snapdragon X15 LTE

(Category 15/13)
DL = 800Mbps
3x20MHz CA, 256-QAM
UL = 150Mbps
2x20MHz CA, 64-QAM

[Originally posted 23-October-2019]

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