Roadmap shows MediaTek Dimensity 600 coming soon Dimensity 400 by the end of the year. No word on Dimensity 720. Qualcomm Snapdragon 662 & 460 in 2020
In a new leak from Chinese social media site Weibo, a timeline of chipset launches has been revealed which is apparently based on research conducted by an investment bank. The accuracy of the source is unknown, nor is how the investment back would know such an accurate timeline of two competing companies. The timeline indicates…












