It is unlikely you will have ever heard of Unisoc, the company is relatively new since being rebranded from Spreadtrum Communications, Inc and is a fabless semiconductor company headquartered in Shanghai producing chipsets form mobiles and IoT devices.

They predominantly focus on the Chinese market as well as developing markets, the same could have been said about Huawei and Xiaomi a few years ago, and look at them now.

I became aware of the company when they launched the Unisoc Tiger T710 SoC, which on the surface looked like an unremarkable chipset, but the dedicated NPU they developed allowed it to outperform many high-end chipsets in AI benchmarks.

Up until the end of last year, the Unisoc Tiger T710 topped the ai-benchmark.com leader board and was only surpassed with the launch of the two MediaTek Dimensity 1000 chipsets (including the 1000L) as well as the two HiSilicon Kirin 990 chipsets.

Unisoc Tiger T752 CPU and GPU

Unisoc Tiger T752 vs Qualcomm Snapdragon 765G vs Mediatek Dimensity 1000L – A 5G mobile chipset made on the 6nm EUV fabrication process that will you never be used in a phone you own 1

Unisoc has now followed this up with the Unisoc Tiger T752, just like the previous chipset, a passing glance makes this look unremarkable. It is an octa-core chipset using four Cortex-A76 at an unknown clock speed combined with four Cortex-A55 cores also at an unknown speed which is then paired with an Arm Mali-G57.

The A76 cores are what we saw on flagship chipsets last year, and the Arm Mali-G57 was announced back in October being a mid-range Valhall based GPU. The Mali-G57 can be configured with anywhere from 1 to 6 cores. On the upper end, it approaches the basic G77 (which has at least 7 cores).

5G Modem

It also has a 5G model build in, so this, therefore, positions it somewhere around the Snapdragon 765G, Samsung Exynos 980 and Mediatek Dimensity 1000L. Unisoc also claims that this is the worlds first 5G modem to support coverage enhancement for all scenarios. This modem supports 5G NR TDD+FDD carrier aggregation and uplink and downlink decoupling and can enhance coverage by more than 100%. UNISOC’s innovative 5G super transmitter technology can increase the uplink speed by up to 60% and meet demanding scenarios such as VR and 4K/8K ultra-high-resolution live streaming. T7520 supports the Sub-6GHz band, NSA/SA dual-mode networking, and 2G through 5G networks. Under the SA mode, it provides a peak uplink speed of more than 3.25Gbps. In addition, it supports dual-SIM dual-5G and EPS Fall-back and VoNR high-resolution audio and video calls.

6nm EUV Fabrication Process

What is interesting about it is the fact it is the first chipset to shrink down to the 6nm EUV fabrication process, putting it ahead of flagship chipsets from the biggest brands in town.

Compared to the previous 7nm process, the 6nm process has an 18% improvement in the density of transistors, which allows more transistors to be integrated per unit area and reduces power consumption by 8%, allowing the battery to last longer.

Unisoc Tiger T752 vs Qualcomm Snapdragon 765G vs Mediatek Dimensity 1000L

 Unisoc Tiger T752Snapdragon 765GExynos 980
Mediatek Dimensity 1000L MT6885Z
Manufacturing Process 6nm EUVSamsung
7nm EUV (7LPP)
8nm LPP
7nm
CPU4x Cortex-A76 @
@ ?

4x Cortex-A55 @ ?
1x Kryo 475 Prime (CA76)
@ 2.3GHz (non-G)
@ 2.4GHz (765G)
1x Kryo 475 Gold (CA76)
@ 2.2GHz
6x Kryo 475 Silver (CA55)
@ 1.8GHz
2x Cortex-A77 @ 2.2GHz
6x Cortex-A55 @ 1.8GHz
4x Cortex-A77 @
@ 2.2GHz

4x Cortex-A55 @ 2.0GHz
GPUArm Mali-G57Adreno 620
Mali G76 MP5
Mali-G77 GPU
RAM2x 16-bit CH

@ 2133MHz LPDDR4X / 17.0GB/s
LPDDR4x 2133MHzLPDDR4x 2133MHz
ModemBuilt in 5G with NSA and SA Snapdragon X52 Integrated

(LTE Category 24/22)
DL = 1200 Mbps
4x20MHz CA, 256-QAM
UL = 210 Mbps
2x20MHz CA, 256-QAM

(5G NR Sub-6 4x4 100MHz
+ mmWave 2x2 400MHz)
DL = 3700 Mbps
UL = 1600 Mbps
Shannon Integrated 5G
(LTE Category 16/18)
DL = 1000 Mbps
5x20MHz CA, 256-QAM
UL = 200 Mbps
2x20MHz CA, 256-QAM

(5G NR Sub-6)
DL = 2550 Mbps
UL = 1280 Mbps

Mediatek M70
AIYes
NPU 50% more power efficient than previous generaiton
Hexagon 696
HVX + Tensor

5.4TOPS AI
(Total CPU+GPU+HVX+Tensor)
Integrated

It is early days to know how this will perform against the current mid-range chipsets, it is dependent on how high the CPU cores are clocked and how many cores the GPU has. It does look promising though, in theory, this should be able to comfortably outperform the Qualcomm Snapdragon 765G and Samsung Exynos 980.

However, it doesn’t really matter how good this chipset is, in reality, it is unlikely anyone in Europe will get to use a phone featuring it. Currently, I am not aware of a single phone using the existing Unisoc Tiger T710. Their mid-range chipsets can be found on some phones such as the ZTE Blade A3 and A7, and they have had a moderate amount of success with their low-end chipsets with several Samsung phones using them such as the Samsung Z1 and Galaxy J3 (2016)

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