Qualcomm is currently holding their annual tech summit in Hawaii this week. This is traditionally when they announce their latest and greatest system on chip which will be responsible for powering most of the flagship phones in 2019 from companies like Samsung, Google, and Xiaomi.
We have already revealed details that the new chip is likely to adopt a tri-cluster design adopting a single high-performance core with three middle cores and four lower powered cores. The details of these cores have again said to be the single Kryo Gold Prime core with a 512KB L2 cache clocked at 2.842GHz. Three Kryo Gold cores with a 256KB L2 cache per core with a maximum frequency of 2.419GHz. Four low-power Kryo Silver cores with a 128KB L2 cache per core clocked at 1.786GHz.
The new chip will also have an elite gaming mode similar to the technology found in Kirin powered Huawei phones.
The chipset manufacturer will be integrating its Snapdragon X24 LTE modem in the Snapdragon 855. However, Qualcomm will also provide its Snapdragon X50 5G modem to its long list of phone manufacturing partners. Internally, the Snapdragon 855 is called SM8150, which is why nearly everyone was led to believe that the official name of the SoC would be Snapdragon 8150.
Samsung has jumped on the dedicated NPU bandwagon this year on the Samsung Exynos 9820, which was started with the Kirin 970 last year, so it comes as no surprise that Qualcomm will be implementing their own. The Qualcomm NPU will provide up to three times more performance than previous Qualcomm-made chips.
The new chip will use something similar to the Night Light feature of the Pixel to improve low-light photography.
The Snapdragon 855 will sport an Adreno 640, but its performance metrics were not provided.