MediaTek Dimensity

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MediaTek and TSMC have announced a significant milestone in their long-standing strategic partnership, with the successful development of MediaTek’s first chip using TSMC’s cutting-edge 3nm process technology. The new chip will be part of MediaTek’s flagship Dimensity system-on-chip (SoC) product line, with volume production expected to begin in 2024.

A New Era of Advanced Chip Technology

TSMC’s 3nm process technology offers enhanced performance, power efficiency, and yield, catering to both high-performance computing and mobile applications. Compared to TSMC’s N5 process, the 3nm technology provides an 18% speed improvement at the same power or a 32% power reduction at the same speed, and approximately a 60% increase in logic density.

MediaTek’s Dimensity SoCs, built with industry-leading process technology, are designed to meet the ever-increasing user experience requirements for mobile computing, high-speed connectivity, artificial intelligence, and multimedia. The first flagship chipset using TSMC’s 3nm process is expected to empower a wide range of devices, including smartphones, tablets, intelligent cars, and more, starting in the second half of 2024.

Collaboration for Innovation

The collaboration between MediaTek and TSMC aims to bring the power of the industry’s most advanced semiconductor process technology to a wide range of devices, making it as accessible as the smartphone in your pocket. Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, said, “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honoured to continue our partnership into the 3nm generation and beyond”.

Joe Chen, President of MediaTek, emphasized the importance of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways. He added that TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to their global customers and enhancing the user experience in the flagship market.

As the tech world eagerly anticipates the arrival of MediaTek’s 3nm-powered flagship chip in various devices in 2024, this partnership between MediaTek and TSMC promises to revolutionize the performance and quality of flagship devices, ultimately enhancing the user experience across the board.

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