Author: James Smythe

Samsung I7410 pico projector

Samsung Pico projector phone, first seen at CES in January is to get a European launch at Mobile World Congress in Barcelona. The Samsung projector phone will be able to project content with flexible image sizes in excess of 50-inches. The Samsung projector phones will be available in February in Korea (model name: W7900) and soon be available in the European market (model name: I7410) according to Samsung. Other features will include a 5.0-megapixel camera, high-resolution colour OLED touchscreen and "Intuitive" flick navigation to view presentations and photo slideshows. The phone will also come with built-in audio...

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Intel Clarkdale: CPU with integrated GPU

We have already posted about Intel unveilings its 32nm fabrication process technology as part of the press announcement of the 32nm Westmere CPUs Intel demoed the first CPU with an integrated GPU, codenamed Clarkdale. Unfortunately there have been no specifics about the GPU but Intel told us that we could expect it to offer an improved equivalent of the integrated graphics found in Intel’s current G45 chipset. Designed for the mainstream market, the CPUs will feature two cores, but will also be able to handle four threads via HyperThreading. While the CPU core of the Clarkdale will be built using the 32nm fabrication process the DDR3 memory controller and GPU will be built using 45nm transistors. The three will sit together in a multi-chip package, and communicate via a high-speed QPI link. Arrandale is the mobile version of Clarkdale, also with integrated on die graphics. It will also allow switchable graphics within Windows 7 and Windows Vista, enabling the use of a higher performance GPU when plugged in.  Both Clarkdale and Arrandale will use 5 series chipsets, exclusively with...

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Intel unveils 32nm process technology codenamed Westmere

It has not been very long since Intel launched processors based on the 45nm fabrication process, Intel are now demonstrating the world’s first 32nm processors and announced massive plans for the technology. Intel are planning on spending a massive $7 billion US over the next two years on building the four 32nm fabrication plants, creating 7,000 high-skill jobs in the US. One is already up and running in Oregon, where another plant is scheduled to be running by the end of 2009. Meanwhile, two further fabs will be built in Arizona and New Mexico in 2010. When Intel released the 45nm chips they started to use a high-k gate dielectric and a metal gate, as opposed to the Silicon Oxide dielectric and polysilicon gate used in Intel’s previous 65nm chips. This change was due to the fact that when transistor gate sizes get to small tunnelling will begin to occur, where electrons will simply pass through the channel(gate) on their own due to the source (where electrons come from) and the drain (where they go) will be extremely close. The high-k and metal gate material Intel uses is believed to be based on hafnium compounds (e.g. hafnium oxide or hafnium silicate). The new 32nm process technology will use the same materials as the 45nm technology however Intel are keen to point out that this technology is now more refined...

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Palm Pre Official Specs

Over at our Palm Pre blog we just posted about Sprint releasing some official information regarding the Palm Pre. Ok well we know most of the Palm Pre’s specification anyway but print just updated their site with the Palm Pre’s specs and it does include some nice bits of information. The 2 main features to note is the inclusion of MMS and the ability to use the phone as a modem via Bluetooth or USB tethering. USB tethering is quite important as it pisses me right off when I am travelling and want to connect to the net via my phone and I am unable to do so! PreCentral also pointed out the following about the storage: 7.4GB will actually be available from the 8GB included, possibly implying the size of the OS is somewhere in the neighborhood of 50 megs or so (though it's still unclear what the relationship between the 8GB of storage and RAM will be, and whether or not the Pre will use Program Memory RAM/Storage ROM/Mass Storage like Windows Mobile or have a simpler RAM/Storage setup like other...

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Official Nokia E75 specification thanks to Expansys + release date

Companies like Expansys and Play like to list products as soon as possible, partly for publicity, partly to get the search engine rankings and partly for the pre-orders. Expansys are now listing the Nokia E75 allowing people to pre-order it for its expected release date of 13 Mar 09. The features include: Quad-band GSM / EDGE, dual-band HSDPA (900/2100) at 3.6Mbps 2.4″ 240×320 QVGA display 3.2 megapixel camera with auto-focus, digital zoom, LED flash 30FPS QVGA video recording aGPS WiFi FM radio microSDHC 3.5mm headset, Bluetooth 2.0, microUSB Nokia Maps, PDF Document Viewer, ZIP File Manager Dual home screen (work/personal) 1000 mAh battery 630 mins talk, 408 hrs stand-by time To be honest the specification seems a little weak especially if you compare it to the forthcoming Nokia N97, however it is an E-Series so it will no doubt be bought up by plenty of business users, also the 1000 mAh looks a little poor especially if you compare it to the excellent Nokia E71’s 1500 mAh battery. Full specification from Expansys after the jump. •Battery: – Capacity: 1000 mAh •Display: – 320 x 240 pixels •Network: – GSM: 850/900/1800/1900 (Quad-Band) – WCDMA: 900/2100 (Dual-Band) – HSDPA (3.6Mbps) •Camera: – 3.2 mega-pixels (auto-focus) – Digital Zoom – LED Flash •Video: – Hi-Resolution VGA Video Recording – 30fps Video Recording (QVGA) – Supported formats: MP4, 3GP, H.264, Flash, H.263 &...

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